Layer count

2 layers (top and bottom)

Material

FR-4, High-Tg FR-4, Rogers, PTFE, Aluminum substrate, etc.

Board Thickness

0.2mm – 3.2mm

Copper Thickness

0.5 Oz (17.5 µm) – 4 Oz (140 µm)

Minimum Hole Size

0.15mm-0.25mm (6mil-10mil)

Minimum Trace/Space Width

3mil/3mil (0.0762mm/0.0762mm)

Aspect Ratio

10:1 or better

Maximum Board Size

500mm x 1100mm (20" x 44")

Surface Finish

HASL, Lead-Free HASL, ENIG, Immersion silver, OSP, Hard Gold, etc.

Solder Mask

Green, Blue, Yellow, Black, Red, White, and other colors

Solder Mask Resolution

4mil (0.1mm) minimum

Solder Mask Registration

±2mil (±0.0508mm)

Silkscreen Color

White, Black, Yellow, and other colors

Plated Through Holes (PTH)

Yes

Blind & Buried Vias (BBV)

No

Controlled Impedance

Yes, depending on the manufacturer's capability

Rigid-flex Capability

No

Electrical Testing

Continuity & isolation, impedance control

Certification

ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard