Layers

1-40+ layers, depending on manufacturer's capability

Materials

FR-4 (standard), FR-4 High-Tg, Aluminum, Rogers, and other special materials

Board Thickness

0.2mm – 6mm, variations within this range are acceptable

Copper Thickness

1/3 Oz (12 µm) – 6 Oz (210 µm), depends on design and material requirements

Minimum Trace Width/Spacing

3mil/3mil (0.0762mm/0.0762mm) or better, depending on design and materials

Minimum Hole Size

0.2mm (8mil) or larger, depending on layer count and manufacturer's capability

Aspect Ratio

10:1 or higher, depends on the manufacturer's capability

Max Board Size

Varies, typically up to 600mm x 1200mm or larger, depending on manufacturer's capabilities

Surface Finish

ENIG, Immersion Silver, OSP, HASL, Lead-Free HASL, ENEPIG, Hard Gold (finger), etc.

Solder Mask

Green, Blue, Yellow, Black, Red, White, and other colors

Solder Mask Resolution

4mil (0.1mm) minimum

Solder Mask Registration

±2mil (±0.0508mm)

Silkscreen Color

White, Black, Yellow, Blue, Red

Plated Through Holes (PTH)

Yes

Blind & Buried Vias (BBV)

Yes, depending on the manufacturer's capabilitie

Via-in-Pad

Yes, filled and capped vias

Controlled Impedance

Yes, can be achieved in single-ended or differential pairs, depending on material, stack-up, and trace geometry

Routing & Scoring

V-groove (V-cut), Tab-routing (mouse bites), and individual routing

Electrical Testing

Continuity & isolation, impedance control, Hi-Pot, etc.

Mechanical Assembly

Supported, requires a close relationship between the PCB manufacturer and assembly provider

Special Routing Features

Castellated holes, countersinks, counterbores, slots, and notched routes

Certification

ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard