| Layer count |
4 - 40+ layers, with various HDI structures such as 1+N+1, 2+N+2, 3+N+3, and ELIC (Every Layer Interconnect) |
| Base Material |
FR-4, High Tg FR-4, Halogen-free, Rogers, or other high-performance materials |
| Board Thickness |
0.2mm - 6.0mm |
| Copper Thickness |
0.5 oz - 6 oz (17.5μm - 210μm) |
| Minimum Hole Size |
0.1mm for mechanically drilled microvias, 0.075mm for laser-drilled microvias |
| Minimum Trace/Space Width |
2 mils (50μm) for standard HDI, down to 1 mil (25μm) for advanced designs |
| Solder Mask |
LPI (Liquid Photo-Imageable) in Green, Yellow, White, Black, Blue, Red, and other custom colors |
| Silkscreen |
White, Black, Yellow, and other custom colors |
| Surface Finishes |
ENIG, OSP, Immersion Silver, Immersion Tin, HASL |
| Blind/Buried Vias |
Yes, to enable routing between adjacent or non-adjacent layers |
| Minimum Annular Ring |
2 mils (50μm) for outer layers, 1 mil (25μm) for inner layers |
| Controlled Impedance |
Tolerance of ±10% or better |
| Special Features |
mbedded or integrated passive components (resistors, capacitors, etc.), rigid-flex designs, back drilling, etc. |
HYBRIDRICE
