HOME > PCB Products
High-Frequency PCB
Online contact
Layer count Single-sided, double-sided, and multilayer (up to 40+ layers)
Material Taconic, Isola, PTFE, Arlon, and FR-4 High-Tg
DK (Dielectric Constant) 2.0 to 10 (more stable materials are required for high frequencies)
DF (Dissipation Factor) Low values, typically <0.005 for high-frequency applications
Board Thickness 0.1mm – 6.0mm
Copper Thickness 0.5 Oz (17.5 µm) – 5 Oz (175 µm)
Minimum Trace Width/Spacing 4mil/4mil (0.1016mm/0.1016mm) or better, depending on design and materials
Minimum Hole Size 0.2mm (8mil) – 0.4mm (16mil) or larger, depending on layer count
Aspect Ratio 10:1 or better, depends on the manufacturer's capability
Maximum Board Size 500mm x 1100mm (20" x 44") or larger, varies with layer counts
Surface Finish HASL, Lead-Free HASL, ENIG, Immersion Silver, OSP, etc.
Solder Mask Green, Blue, Yellow, Black, Red, White, and other colors
Solder Mask Resolution 4mil (0.1mm) minimum
Solder Mask Registration ±2mil (±0.0508mm)
Silkscreen Color White, Black, Yellow
Plated Through Holes (PTH) Yes
Blind & Buried Vias (BBV) Yes, depending on the manufacturer's capability
Controlled Impedance Yes, tightly controlled impedance is essential for high-frequency applications
Electrical Testing Continuity & isolation, impedance control, Hi-Pot, etc.
Thermal Management Required for high-frequency applications, might include thermal vias, heat sinks, and metal cores
Certification ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard