| Layer count |
Single-sided, double-sided, and multilayer (up to 40+ layers) |
| Material |
Taconic, Isola, PTFE, Arlon, and FR-4 High-Tg |
| DK (Dielectric Constant) |
2.0 to 10 (more stable materials are required for high frequencies) |
| DF (Dissipation Factor) |
Low values, typically <0.005 for high-frequency applications |
| Board Thickness |
0.1mm – 6.0mm |
| Copper Thickness |
0.5 Oz (17.5 µm) – 5 Oz (175 µm) |
| Minimum Trace Width/Spacing |
4mil/4mil (0.1016mm/0.1016mm) or better, depending on design and materials |
| Minimum Hole Size |
0.2mm (8mil) – 0.4mm (16mil) or larger, depending on layer count |
| Aspect Ratio |
10:1 or better, depends on the manufacturer's capability |
| Maximum Board Size |
500mm x 1100mm (20" x 44") or larger, varies with layer counts |
| Surface Finish |
HASL, Lead-Free HASL, ENIG, Immersion Silver, OSP, etc. |
| Solder Mask |
Green, Blue, Yellow, Black, Red, White, and other colors |
| Solder Mask Resolution |
4mil (0.1mm) minimum |
| Solder Mask Registration |
±2mil (±0.0508mm) |
| Silkscreen Color |
White, Black, Yellow |
| Plated Through Holes (PTH) |
Yes |
| Blind & Buried Vias (BBV) |
Yes, depending on the manufacturer's capability |
| Controlled Impedance |
Yes, tightly controlled impedance is essential for high-frequency applications |
| Electrical Testing |
Continuity & isolation, impedance control, Hi-Pot, etc. |
| Thermal Management |
Required for high-frequency applications, might include thermal vias, heat sinks, and metal cores |
| Certification |
ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard |
HYBRIDRICE
