HYBRIDRICE
| Layer count | 1-6 layers (flex area) and up to 20 or more layers (rigid area, depending on manufacturer capability) |
|
Material |
Polyimide, FR-4, and FR-4 High-Tg |
| Board Thickness | Flexible area: 0.05mm – 0.3mm, Rigid area: 0.5mm – 3.2mm, but can vary by manufacturer |
| Copper Thickness | 1/3 Oz (12 µm) – 2 Oz (70 µm), depends on design and material requirements |
| Minimum Trace Width/Spacing | 3mil/3mil (0.0762mm/0.0762mm) or better, depending on design and materials |
|
Minimum Hole Size |
0.2mm (8mil) or larger, depending on layer count |
|
Aspect Ratio |
10:1 or better, depends on the manufacturer's capability |
| Max Board Size | Varies depending on design constraints and manufacturer capabilities, typically up to 400mm x 500mm |
|
Surface Finish |
ENIG, Immersion Silver, OSP, HASL, Lead-Free HASL, etc |
|
Solder Mask |
Green, Blue, Yellow, Black, Red, White, and other colors |
|
Solder Mask Resolution |
4mil (0.1mm) minimum |
|
Solder Mask Registration |
±2mil (±0.0508mm) |
|
Silkscreen Color |
White, Black, Yellow |
|
Coverlay |
Polyimide, with or without adhesive, depending on the application requirements |
|
Plated Through Holes (PTH) |
Yes |
|
Blind & Buried Vias (BBV) |
Yes, depending on the manufacturer's capability in both flex and rigid areas |
|
Controlled Impedance |
Yes, can be achieved in both rigid and flexible areas |
|
Stiffeners |
FR-4, Polyimide, or Stainless Steel, installed to provide support and rigidity when needed |
|
Electrical Testing |
Continuity & isolation, impedance control, Hi-Pot, etc. |
|
Mechanical Assembly |
Supported |
| Certification | ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard |
