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Rigid-flex PCB
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Details
Layer count 1-6 layers (flex area) and up to 20 or more layers (rigid area, depending on manufacturer capability)

Material

Polyimide, FR-4, and FR-4 High-Tg
Board Thickness Flexible area: 0.05mm – 0.3mm,
Rigid area: 0.5mm – 3.2mm, but can vary by manufacturer
Copper Thickness 1/3 Oz (12 µm) – 2 Oz (70 µm), depends on design and material requirements
Minimum Trace Width/Spacing 3mil/3mil (0.0762mm/0.0762mm) or better, depending on design and materials

Minimum Hole Size

0.2mm (8mil) or larger, depending on layer count

Aspect Ratio

10:1 or better, depends on the manufacturer's capability
Max Board Size Varies depending on design constraints and manufacturer capabilities, typically up to 400mm x 500mm

Surface Finish

ENIG, Immersion Silver, OSP, HASL, Lead-Free HASL, etc

Solder Mask

Green, Blue, Yellow, Black, Red, White, and other colors

Solder Mask Resolution

4mil (0.1mm) minimum

Solder Mask Registration

±2mil (±0.0508mm)

Silkscreen Color

White, Black, Yellow

Coverlay

Polyimide, with or without adhesive, depending on the application requirements

Plated Through Holes (PTH)

Yes

Blind & Buried Vias (BBV)

Yes, depending on the manufacturer's capability in both flex and rigid areas

Controlled Impedance

Yes, can be achieved in both rigid and flexible areas

Stiffeners

FR-4, Polyimide, or Stainless Steel, installed to provide support and rigidity when needed

Electrical Testing

Continuity & isolation, impedance control, Hi-Pot, etc.

Mechanical Assembly

Supported
Certification ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard