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Robot
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Parameter Capability
Layer count 1-40 layers
Assembly Type Through-Hole (THT), Surface Mount (SMT), Mixed (THT+SMT)
Minimum Component Size 0201 or 0402 (Imperial) / 0603 or 1005 (Metric)
Maximum Component Size 2.0 in x 2.0 in x 0.4 in (50 mm x 50 mm x 10 mm)
Component Package Types BGA, QFN, QFP, SOIC, SOP, SSOP, TSSOP, PLCC, DIP, etc.
Minimum Pad Pitch 0.5 mm (20 mil) for QFP, QFN, 0.8 mm (32 mil) for BGA
Minimum Trace Width 0.10 mm (4 mil)
Minimum Trace Spacing 0.10 mm (4 mil)
Minimum Drill Size 0.15 mm (6 mil)
Maximum Board Size 18 in x 24 in (457 mm x 610 mm)
Maximum Board Thickness 0.062 in (1.6 mm) to 0.125 in (3.2 mm)
Board Material FR-4, High-Tg FR-4, Aluminum, High Frequency, Flexible(FPC), Rigid-Flex, Rogers, etc.
Surface Finish HASL, Immersion Gold, Gold Finger, OSP, Immersion Silver, etc.
Solder Paste Type Leaded or Lead-Free
Assembly Process Reflow Soldering, Wave Soldering, Hand Soldering
Inspection Methods Automated Optical Inspection (AOI), X-ray, Visual Inspection
Testing Methods In-Circuit Test (ICT), Functional Test (FCT),
Flying probe test
Design for Manufacturing (DFM) DFM Analysis and Feedback
Turnaround Time Prototype: 24 hours to 7 days, Production: 10 days to 4 weeks
PCB Assembly Standards ISO9001:2015;ISO13485:2016;ROHS,UL 94v0, IPC-600G classll and IPC-6012B classll standard